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SP1005 Semiconductor Device Molding Laminator


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Product Description

Product description:

SP1005 semiconductor device molding laminator is a new type of semiconductor device laminator, using digital servo and molding technology, separation film release and vacuum heating technology; specifically for colloidal molding of semiconductor devices, especially suitable for planar array high power LED Spherical lens package molding process.


Features:

Provides advanced integrated packaging for high brightness LED products;

LED product packaging is completed by molding, suitable for planar array packaging, forming hundreds of devices at a time;

Separation membrane release technology eliminates the need for mold cleaning and protects the environment and increases economic efficiency;

Vacuum heating to effectively reduce product bubbles and make products more reliable


Technical Parameters:

 
Specification
Function parameter
Host laser marking (optional)
Pressure
50KN
Mold strok
175mm
Maximum temperature
200℃
Effective package area
90mm*60mm
Hourly outp
3000pcs/h
Device optical lens roughness
<Ra0.2
Power
3Φ200V&14KW
Gas source
0.4-0.6MPa
Vacuum & exhaust
<10Pa&15m3/min
Dimensions
1140mm(W)*1450mm(D)*1620mm(H)
Total weight
2000Kg

 

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