Product Details
Product Description
Product description:
SP1005 semiconductor device molding laminator is a new type of semiconductor device laminator, using digital servo and molding technology, separation film release and vacuum heating technology; specifically for colloidal molding of semiconductor devices, especially suitable for planar array high power LED Spherical lens package molding process.
Features:
Provides advanced integrated packaging for high brightness LED products;
LED product packaging is completed by molding, suitable for planar array packaging, forming hundreds of devices at a time;
Separation membrane release technology eliminates the need for mold cleaning and protects the environment and increases economic efficiency;
Vacuum heating to effectively reduce product bubbles and make products more reliable
Technical Parameters:
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Specification
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Function parameter
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Host laser marking (optional)
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Pressure
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50KN
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Mold strok
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175mm
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Maximum temperature
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200℃
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Effective package area
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90mm*60mm
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Hourly outp
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3000pcs/h
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Device optical lens roughness
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＜Ra0.2
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Power
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3Φ200V&14KW
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Gas source
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0.4-0.6MPa
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Vacuum & exhaust
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＜10Pa&15m3/min
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Dimensions
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1140mm(W)*1450mm(D)*1620mm(H)
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Total weight
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2000Kg
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0755-23245033
Service Hotline
10th Floor, Building 2, Tianliao Community, Guangming New District, Shenzhen (Hanhaida High-tech Industrial Park)
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