SP1005 Semiconductor device molding machine-Shenzhen Liangji Automation Equipment Co., Ltd.

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SP1005 Semiconductor device molding machine

Category:

Semiconductor (IC) Product Lineup

SP1005 semiconductor device molding machine is a new type of semiconductor device molding machine. It adopts digital servo and molding technology, separation film demoulding and vacuum heating technology; it is specially used for colloidal molding of semiconductor devices, especially for planar array high-power LEDs Spherical lens packaging molding process.

Product Description

Product description:

SP1005 semiconductor device molding machine is a new type of semiconductor device molding machine, which adopts digital servo and molding technology, separation film demoulding and vacuum heating technology; it is specially used for colloidal molding of semiconductor devices, especially for flat-array high-power LEDs Spherical lens packaging molding process.

Features:

Provide advanced integrated packaging, suitable for manufacturing high brightness LED products;

LED product packaging is completed by molding, which is suitable for flat array packaging, and hundreds of devices can be molded at one time;

Using the separation membrane demoulding technology, no need to clean the mold, it can protect the environment and increase economic benefits;

Vacuum heating and curing can effectively reduce product bubbles and make products more reliable