Product Details
SP1005 Semiconductor device molding machine
Category:
SP1005 semiconductor device molding machine is a new type of semiconductor device molding machine. It adopts digital servo and molding technology, separation film demoulding and vacuum heating technology; it is specially used for colloidal molding of semiconductor devices, especially for planar array high-power LEDs Spherical lens packaging molding process.
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Product Description
Product description:
SP1005 semiconductor device molding machine is a new type of semiconductor device molding machine, which adopts digital servo and molding technology, separation film demoulding and vacuum heating technology; it is specially used for colloidal molding of semiconductor devices, especially for flat-array high-power LEDs Spherical lens packaging molding process.
Features:
Provide advanced integrated packaging, suitable for manufacturing high brightness LED products;
LED product packaging is completed by molding, which is suitable for flat array packaging, and hundreds of devices can be molded at one time;
Using the separation membrane demoulding technology, no need to clean the mold, it can protect the environment and increase economic benefits;
Vacuum heating and curing can effectively reduce product bubbles and make products more reliable
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10th Floor, Building 2, Tianliao Community, Guangming New District, Shenzhen (Hanhaida High-tech Industrial Park)
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